1. Core Specifications

• Logic Elements (LEs): 10,320 cells 345.

• Logic Blocks (LABs/CLBs): 645 blocks 614.

• Embedded Memory: 414 Kbit (423,936 bits) of RAM 3514.

• DSP Multipliers: Up to 360 × 18-bit multipliers 3.

• Maximum Operating Frequency:

  • Core: 402 MHz 14.

  • Memory Interfaces: Supports DDR2 SDRAM up to 200 MHz 36.

💾 2. I/O and Interfaces

• I/O Pins: 91 user I/Os 356.

• LVDS Support: Up to 840 Mbps (Tx) and 875 Mbps (Rx) 3.

• Protocol Support:

  • Gigabit Ethernet, PCIe Gen 1, CPRI, SATA, Serial RapidIO, DisplayPort 311.

  • Dedicated hard IP for PCI Express (PIPE) 3.

• Clocking: Up to 8 phase-locked loops (PLLs) per device 3.

⚡ 3. Power Characteristics

• Operating Voltage:

  • Core: 1.15V–1.25V 5614.

  • I/O: Up to 3.6V 14.

• Power Consumption:

  • <1.5W for protocol bridging applications 311.

  • Transceiver power: 150 mW per channel (if applicable) 3.

📐 4. Physical Characteristics

• Package: 144-pin EQFP (Exposed Pad Quad Flat Pack), dimensions 20×20 mm 4511.

• Mounting: Surface-mount (SMD/SMT) 56.

• Temperature Range:

  • Commercial: 0°C to 85°C (TJ) 5614.

  • Industrial grade also available 3.

🔧 5. Additional Features

• On-Chip Termination (OCT): Supports bus hold and programmable I/O delays 514.

• Transceivers (Cyclone IV GX variant): Up to 8 channels at 3.125 Gbps 3.

• Configuration: Supports volatile SRAM-based programming 4.

• Development Tools: Compatible with Altera Quartus Prime and ModelSim 4.

📦 6. Applications

• Cost-sensitive, high-volume systems (e.g., industrial control, communications) 3.

• Low-power protocol bridging, embedded processing, and I/O expansion